royal皇家88(集团)

Recently, ASR Microelectronics was invited to attend the TSMC 2025 China Symposium, where it presented a range of innovative chip products and solutions in the Innovation Zone, covering key areas such as 5G, smartphones, smart wearables, and AI convergence. As one of the few fabless semiconductor companies globally with in-house development capabilities for full-standard cellular baseband chips spanning 2G to 5G, ASR continues to drive breakthroughs in wireless communication core technologies, enabling faster product iteration and value creation for its ecosystem partners.

At this year’s symposium, ASR Microelectronics showcased several representative chip platforms and end products centered on key directions in cellular communication, demonstrating its comprehensive platform capabilities:

• RedCap Platforms for Industrial IoT and Lightweight Smart Terminals — ASR1903 & ASR3901:These platforms comply with 3GPP Release 17, supporting NR SA/LTE Cat.4 dual modes. They offer wide band coverage and support for native 5G features such as network slicing, time synchronization, high-precision positioning, and 5G LAN. The platforms are optimized for power efficiency, hardware complexity, and deployment cost, making them highly adaptable for applications such as smart wearables, smart grids, smart cities, and the Industrial IoT.、
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• Next-Generation Octa-Core Smartphone Platform — ASR866X Series:Featuring high-performance octa-core ARM Cortex CPUs and LPDDR4x memory, this platform integrates powerful computing and AI multimedia processing capabilities. It includes a high-performance GPU and proprietary ISP for AI-powered image processing. The platform supports comprehensive wireless connectivity including Wi-Fi 6, Bluetooth 5.4, GNSS, and FM. Notably, the ASR8661 model offers up to 1 TOPS NPU performance, addressing diverse demands in performance, connectivity, and AI for smartphones and smart devices.
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• World’s First RedCap + Android Dual-Platform Chip — ASR8603 Series:This groundbreaking platform combines 5G RedCap connectivity with the Android OS. It features a high-performance quad-core architecture (1x Cortex-A76 @1.8GHz + 3x Cortex-A55 @1.5GHz), strong AI and multimedia capabilities, abundant I/O interfaces, and broad ecosystem support. It enables smooth user experiences and is suitable for a wide range of lightweight consumer terminals and IoT applications.
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ASR also showcased various representative end products built on its chip platforms, including 5G CPEs, octa-core smartphones, smartwatches, AI-powered toys, and PoC terminals, highlighting its achievements in both consumer electronics and industrial IoT markets.

As a long-term strategic partner of ASR Microelectronics, TSMC has provided robust support across multiple generations of ASR’s communication chips through advanced process technologies, platform services, and ecosystem resources, enabling fast product iteration and technological implementation.

Moving forward, ASR Microelectronics will continue to collaborate closely with TSMC, solution providers, and device manufacturers to co-create high-performance, high-quality chip platforms, further expanding the benefits of communication technologies across industries.